langue fr TE Connectivity - 30/07/2020

Co-Packaging Socket Technology | DesignCon 2020

Chris Blackburn, Technologist at TE Connectivity, presents a new socket technology that allows contact pitches down to 0.4mm with excellent signal integrity aimed at the developing OIF CEI-112G-XSR channel requirements. The use of these sockets allows replaceable optical engines during manufacturing of co-packaged optics and switch silicon. The co-packaging solution allows integration of TEs thermal bridge technology for thermal management of the optics while also incorporating TEs XLA socket technology. Learn more:

TE Connectivity is a $13 billion global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions, proven in the harshest environments, enable advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With nearly 80,000 employees, including more than 8,000 engineers, working alongside customers in approximately 15 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at

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