langue fr TE Connectivity - 30/07/2020

Thermal Bridge Technology for I/O Applications

Todays data communication applications have increasingly demanding system power requirements which often require better ways to dissipate heat. Traditional thermal management approaches such as riding heatsinks dont always provide the optimum solution for applications with restricted airflow, liquid cooling or cold-plates. But what if there was a new way to approach this problem? We have the solution - TEs new thermal bridge technology for input/output applications. Developed in direct response to market needs for a better performing thermal solution, the thermal bridge technology provides up to 2X better thermal resistance over traditional thermal technologies. Learn more:

TE Connectivity is a $13 billion global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions, proven in the harshest environments, enable advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With nearly 80,000 employees, including more than 8,000 engineers, working alongside customers in approximately 15 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at

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